Thermal fluid simulation software(CPU) - List of Manufacturers, Suppliers, Companies and Products

[Example] Electronic Device Heat Dissipation 'AICFD'

Application in conjugate heat conduction analysis for electronic component heat dissipation and battery pack cooling analysis for new energy vehicles!

We would like to introduce application examples of our intelligent thermal fluid analysis software "AICFD" for electronic device heat dissipation. This software provides user-friendly and high-performance simulations through an advanced graphical interface. It can be applied to cooling analysis of battery packs, which are widely used in fields such as electric vehicles, mobile devices, and energy storage. Improving the performance of battery packs can be crucial. You can check the details of the case studies through the related links. 【Case Overview (Partial)】 ■ Conjugate heat conduction analysis for electronic component heat dissipation - Heat dissipation analysis of electronic components within a casing, using laminar flow for conjugate heat conduction analysis - Memory chips are located next to the CPU unit, and various sizes of capacitors, chips, and interfaces are embedded on the motherboard - The radiator is positioned above the CPU, transferring heat from the CPU to the cooling air *For more details, please download the PDF or feel free to contact us.